What we do
Process Control & Services
Assembly Procedures
At Advotech we are constantly adding and improving upon the services we offer as technology advances. Here are some of the additional skills our technicians can offer when manufacturing your PCB design.
Mechanical Testing
Services include wire pull up to 100g, die shear up to 100Kg and BGA & ball bond shear. These tests can be conducted at destruct or non-destruct levels.
Visual Inspection and Measurement
We are equipped with high-power microscopes, cameras, and software to capture and measure visual data that can be useful for verification, failure analysis, and reporting.
X-ray
We provide X-ray services for process verification and failure analysis. Solder voids, shorts, missing and broken wires are just some of the defects that can be revealed by X-ray when visual inspection is not enough.
Encapsulation
We can protect your die and wire bonds by encapsulating them with epoxy and by placing a cover over them. Black and clear epoxy options are available.
Temperature Cycling
Temperature capability of -40C to 150C. Large chambers and multiple systems.
Pick & Place
Die sorting from wafers up to 8.0” or 200mm. Diced die can be placed into waffle packs or Gel Paks.
Programmable Dispensing
Specialized patterns for die attach, clear or black glob top for bonded wire protection, or flip chip underfill.
LED & MEMS
Prototype to Medium Volume LED and MEMs assemblies including flex circuits & custom devices.