Who we are
Wire Bonding
We have the equipment and know-how to accomplish even the most difficult wire bonding applications. If your product is still in the design stage, we encourage you to contact us for suggestions for designing for manufacturability.
Methods include:
- Ball Bonding - gold, copper, and silver wire - down to 35μm pitch
- Wedge bonding - Au or Al wire up to 50μm wire diameter
- Au stud bumping
- Au ribbon bonding
We can wire bond to various substrates including ceramic, PCBs, flex circuits, and modules. Please contact us for surface finish requirements.
Wire Bonder Specifications
Wire Diameters: 17.8µm to 50µm (0.7 mil - 2.0 mil)
Wire Capacity 14K Wires per process programs ; 25k wires for premium
Wire Material: Gold
Bondable Area: 56mm (X) x 80 mm (Y)
Die Specifications
Minimum Die Size: 0.2mm (0.008 in) square
Maximum Rotation : ± 10 degrees
Maximim Tilt: ±60 µm (0.0024 in) corner to corner
Wire Capacity 14K Wires per process programs ; 25k wires for premium
Wire Material: Gold
Bondable Area: 56mm (X) x 80 mm (Y)
Die Specifications
Minimum Die Size: 0.2mm (0.008 in) square
Maximum Rotation : ± 10 degrees
Maximim Tilt: ±60 µm (0.0024 in) corner to corner