Who we are
Dicing
Besides volume processing, we specialize in prototypes and proof-of-concept. We are experienced at dicing semiconductor wafers, multi-project wafers, and individual reticles for maximum yield. Additionally, we can support a wide variety of materials:
- Silicon
- Glass
- Quartz
- Sapphire
- Ceramic
- BGAs
- FR4
- Flex circuits
- Plastics
- MEMs
Dicing Specifications
Max wafer Size: 8 inch round or square
Spindle Size: 2 inch
Spindle speeds: 3,000 to 60,000 rev/min
Dicing speed: 0.1-500mm/sec
Performs cutting, dicing and scribing operations
Spindle Size: 2 inch
Spindle speeds: 3,000 to 60,000 rev/min
Dicing speed: 0.1-500mm/sec
Performs cutting, dicing and scribing operations